LG G8 ThinQ Motherboard Replacement
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Unplug and power off your phone before you begin.
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Insert the SIM card eject tool into the pinhole in the lower right side of the phone.
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Remove the SIM card and tray.
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Place the phone so that the screen is facing down.
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Insert opening cards between the back panel and frame of the phone to loosen the clips and adhesive.
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Using equal pressure, carefully pry the back panel away from the phone.
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Once enough space has been created, use an opening tool to completely separate the back panel from the phone.
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Remove all 14 screws from the midframe using a Phillips #000 screwdriver.
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Work an opening tool around the perimeter of the midframe to pry and remove it from the phone.
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Using an opening tool, carefully pry out remove the speaker system from the phone.
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Using an opening tool, carefully disconnect the ribbon cable connecting the 3.5mm audio jack to the motherboard.
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Remove the screw holding the 3.5 mm audio jack in place using a Phillips #000 screwdriver.
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Remove the audio jack from the phone.
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Flip phone so that screen is facing up.
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Using a heating pad, hairdryer, or heat gun, apply heat to loosen the adhesive beneath the battery.
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Use an opening tool to disconnect the two coaxial cables from the motherboard.
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To reassemble your device, follow these instructions in reverse order.
To reassemble your device, follow these instructions in reverse order.
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