Something about A1708( If you want to see more electronic components product-data,this web is a good choic: http://www.hqew.net/product-data )

PRODUCT DESCRIPTION:

 Base chemistry: epoxy only, cationic polymerization

 One component adhesive ready for use, solvent-free, UV and/or heat curing

PRODUCT USE:

 Active alignment of components for optoelectronics and semiconductor packaging

 High precision bonding  Bonding of opaque substrates and optical parts

FEATURES:

 Epoxy only, high adhesion, high Tg, long shelf and working life, room temperature stable, not sensitive to oxygen in cure process, excellent reliability performances, robust for solder reflow process

INSTRUCTIONS FOR USE:

1) Clean the substrates to remove contamination, dust, moisture, salt and/or oil

2) Dispense adhesive on substrates

3) Bond substrates (with active alignment – optional)

4) UV cure to fix alignment or to bond

5) Thermal cure: to cure adhesive in shadow area and to improve adhesion of bonded parts