Proper soldering takes practice. There are many factors including what you are soldering, tip size, temperature and solder type. WHAT: SMD device or ground connection. Tip: point or wedge, small or large. Temp: low or high. Solder: thin or thick, leaded or not.
Large joints, like on ground connections, require more heat so a larger tip and a higher temp is needed - but you only have a fixed temp.
Smaller connections use less heat and a smaller tip. Your heat is probably OK for you current job unless it involved a larger surface area/heat sink.
Heat is extracted from the tip when you contact the joint. If you have a small tip on a large joint you may never get the joint to the proper temp.
If you have a low temp and a large tip you will have the same problem. You might also damage the joint because you are holding the tip too long on it.
If you have a small joint and a large tip or a small tip and a high temp you run the risk of damaging the joint.
The optimum, is the right size tip and the right temp to heat the joint quickly, melt the solder into the joint and remove the heat so as not to damage the joint.
The solder must flow onto all parts of the joint. It must be shiny when finished. Dull solder is a bad solder.
The tip must also be tinned and shiny with some solder melted on it b4 you apply it to the joint. That will allow a faster transfer of heat to the joint.
If the joint parts have not previously been soldered you should tin the joints also. It is all about transfering the heat quickly and filling the whole joint and parts with solder.
If there are any holes in the solder on the joint, those parts of the joint didn't get hot enought for the solder to flow.
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