Traduzione in corso passo 19
Passo 19
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So many chips…where's the dip?:
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Skyworks 77449 Power Amplifier Module for LTE/EUTRAN Bands XIII/XIV
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Toshiba Y9A0A111308LA Memory Stack
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ST Ericsson CPCAP 6556002
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Hynix H90H1GH51JMP (similar to other devices we've seen, this POP chip sits on top of the TI OMAP 4430 processor)
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Infineon 5726 SLU A1 H1118 3A126586
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Bosch 2133 C3H L1ABG accelerometer
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And the back of the board? Even the PCB is stepped with a cavity to recess the flex wrap from back to front. Nothing spared in the pursuit of ultimate thinness.
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