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Introduzione

Prerequisite only! Use this guide to remove the motherboard cover in your Xiaomi Redmi Note 8T.

  1. Before you begin, switch off your phone.
    • Before you begin, switch off your phone.

    • Apply a heated iOpener to the back of the phone to loosen the adhesive beneath the back cover. Apply the iOpener for at least two minutes.

  2. Secure a suction handle to the bottom of the rear glass, as close to the edge as possible. If the phone's rear glass is cracked, the suction handle may not stick. Try lifting it with strong tape, or superglue the suction handle in place and allow it to cure so you can proceed. Lift the rear glass with the suction handle to create a small gap between the glass  and the frame.
    • Secure a suction handle to the bottom of the rear glass, as close to the edge as possible.

    • If the phone's rear glass is cracked, the suction handle may not stick. Try lifting it with strong tape, or superglue the suction handle in place and allow it to cure so you can proceed.

    • Lift the rear glass with the suction handle to create a small gap between the glass and the frame.

    • Insert an opening pick into the gap.

    • If you have trouble, apply more heat to further soften the adhesive. Follow the iOpener instructions to avoid overheating.

    • Slide the opening pick to the bottom right corner.

  3. Insert a second opening pick and slide it to the bottom left corner  to cut the adhesive. Leave the opening picks in place to prevent the adhesive from resealing.
    • Insert a second opening pick and slide it to the bottom left corner to cut the adhesive.

    • Leave the opening picks in place to prevent the adhesive from resealing.

    • Don't remove the suction handle yet. You're going to use it later in the removal procedure as a rear glass stand.

  4. Insert a third opening pick at the bottom left corner. Slide the tip of the opening pick from the bottom left corner along the side of the phone to cut the adhesive. Leave the opening pick in its place at the top left corner to prevent the adhesive from resealing.
    • Insert a third opening pick at the bottom left corner.

    • Slide the tip of the opening pick from the bottom left corner along the side of the phone to cut the adhesive.

    • Leave the opening pick in its place at the top left corner to prevent the adhesive from resealing.

  5. If the adhesive becomes hard to cut, it has most likely cooled down. Use your iOpener to reheat it. Insert a fourth opening pick under the top left corner of the rear glass.
    • If the adhesive becomes hard to cut, it has most likely cooled down. Use your iOpener to reheat it.

    • Insert a fourth opening pick under the top left corner of the rear glass.

    • Slide the opening pick along the top edge of the phone to cut the adhesive.

    • Leave the opening pick in the top right corner to prevent the adhesive from resealing.

  6. Do not insert the opening pick deeper than 5 mm to avoid damaging the fingerprint connector. Insert a fifth opening pick at the top right corner of the phone.
    • Do not insert the opening pick deeper than 5 mm to avoid damaging the fingerprint connector.

    • Insert a fifth opening pick at the top right corner of the phone.

    • Slide the opening pick along the right side to cut the remaining adhesive.

    • Do not remove the rear glass all the way yet, the fingerprint cable is still connected to the motherboard.

  7. Carefully fold the rear glass to the right side of the phone. Use the suction handle as a stand for the rear glass. Carefully fold the rear glass to the right side of the phone. Use the suction handle as a stand for the rear glass.
    • Carefully fold the rear glass to the right side of the phone. Use the suction handle as a stand for the rear glass.

  8. Use a spudger to pry up and disconnect the fingerprint flex cable. Remove the rear glass.
    • Use a spudger to pry up and disconnect the fingerprint flex cable.

    • Remove the rear glass.

    • During reassembly, this is a good point to power on your phone and test all functions before sealing it up. Be sure to power your phone back down completely before you continue working.

  9. Remove the eleven Phillips #00 screws (3.9 mm length).
    • Remove the eleven Phillips #00 screws (3.9 mm length).

  10. Insert the tip of an opening pick underneath the bottom edge of the motherboard cover. Use the opening pick to pry up the motherboard cover.
    • Insert the tip of an opening pick underneath the bottom edge of the motherboard cover.

    • Use the opening pick to pry up the motherboard cover.

  11. Remove the motherboard cover including the black protective foil that covers the battery. Remove the motherboard cover including the black protective foil that covers the battery.
    • Remove the motherboard cover including the black protective foil that covers the battery.

Conclusione

To reassemble your device, follow these instructions in reverse order.

Dominik Schnabelrauch

Membro da: 23/11/2016

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