iPhone 5s

L'Apple iPhone 5s è stato presentato il 10 settembre 2013. La riparazione di questo dispositivo è simile a quella dei modelli precedenti e richiede cacciaviti e strumenti di apertura. Disponibile nelle versioni GSM o CDMA con capacità di 16 , 32 o 64 GB nei colori Argento, Oro e Grigio Siderale.

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What is the black substance around components On logicboard

Hi. I was just trying to reball an ic but when trying to remove it from the board I noticed this black adhesive/cement stuff around it?

Is there a way to remove this?

I have tried the heat gun at max temperature but this did not soften it?

This is my first board repair and am using a dead board to practice on so not worried about the board.

Thank you

Update.

I used a bit of force and the ic came off but also took a pad with it.

Risposto! Visualizza la risposta Anch'io ho questo problema

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Postato: 18 giu 2015

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trevor, sounds like an epoxy underfill. That is to stabilize the IC on a logic board. Add an image of the IC, its location and the damage so we can see what you see. Take a look at this video and see if it explains it.

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the video is right. Have been checking online and heat with gentle scraping is the only way to remove it.

Tried taking a photo of the damage but it doesn't come out well in the pics.

It's just one pad under the baseband chip. All the others are intact.

19 giu 2015 da trevor

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iPhone 5s

What is the black substance around components On logicboard

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