Parti

Nessuna parte richiesta.

Place prying device along the side crease of the phone. Place prying device along the side crease of the phone.
  • Place prying device along the side crease of the phone.

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Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges. Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges.
  • Slide the prying device downward to disjoin the rear casing from the front casing. Continue around all edges.

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Remove the back casing from the front casing. Force may be necessary.
  • Remove the back casing from the front casing. Force may be necessary.

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Use prying device to remove motherboard from the back of the phone. Use prying device to remove motherboard from the back of the phone.
  • Use prying device to remove motherboard from the back of the phone.

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Conclusione

To reassemble your device, follow these instructions in reverse order.

Erica

Membro da: 14/10/2011

101 Reputazione

6 Guide realizzate

Team

James Madison, Team 1-49, Allen Fall 2011 Membro di James Madison, Team 1-49, Allen Fall 2011

JMU-ALLEN-F11S1G49

3 Membri

8 Guide realizzate

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