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Traduzione in corso passo 4

Passo 4
Slide the opening pick up both sides of the device in the small space between the midframe and the rear case to release the clips holding it in place. Note that the clips are not released by sliding through them, but rather the inward pressure the opening pick creates as it enters the gap around them. If the clasps fail to come undone, try pushing the edge you're working on inward with your hand, or using a thicker tool like a spudger.
  • Slide the opening pick up both sides of the device in the small space between the midframe and the rear case to release the clips holding it in place.

  • Note that the clips are not released by sliding through them, but rather the inward pressure the opening pick creates as it enters the gap around them.

  • If the clasps fail to come undone, try pushing the edge you're working on inward with your hand, or using a thicker tool like a spudger.

  • Do not attempt to remove the midframe yet! There is still a fragile ribbon cable underneath connecting the earpiece speaker to the motherboard.

D'un côté puis de l'autre de l'appareil, faites glisser le médiator le long de l'interstice entre le châssis central et la coque arrière pour ouvrir les clips.

Remarque : ce n'est pas les traverser qui ouvre les clips, mais plutôt la tension créée par le médiator en les approchant.

Si les clips ne se défont pas, essayez en poussant de vos doigts le côté dont vous vous occupez vers l'intérieur ou en utilisant un outil plus épais comme une spatule.

N'essayez pas encore de retirer le châssis central ! Il y a en dessous une nappe fragile qui relie le haut-parleur interne à la carte mère.

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