Salta al contenuto principale

Avviso: Stai modificando una guida prerequisita. Tutte le modifiche avranno effetto sulla guida che include questo passo.

Inglese
Giapponese

Traduzione in corso passo 8

Passo 8
It is common for solder to cover up some of the holes through solder pads on the board.  Opening these holes greatly simplifies soldering. Open the holes through the solder pads by pressing a straightened staple against the blockage while heating the same pad from the other side of the board.
  • It is common for solder to cover up some of the holes through solder pads on the board. Opening these holes greatly simplifies soldering.

  • Open the holes through the solder pads by pressing a straightened staple against the blockage while heating the same pad from the other side of the board.

  • A "third hand" tool (or a friend) can greatly help in this procedure.

基板のはんだパッドの中には、ホールがはんだで覆われているものがよくあります。このようなホールを開通させることで、はんだ付けが非常に簡単になります。

塞がっている部分に真っ直ぐなホッチキスの針を押し付けながら、そのパッドを基板の裏側から加熱して、ホールを開通させます。

3番目の手」となるツール(または友人)があれば、この手順はかなりやりやすくなります。

I tuoi contributi sono usati su licenza in base alla licenza open source Creative Commons.