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Passo 7
Next we will cover a moderately difficult soldering application.  In our case, we will be soldering very thin and delicate leads to a circuit board with small solder pads.
Intermediate Guide
  • Next we will cover a moderately difficult soldering application. In our case, we will be soldering very thin and delicate leads to a circuit board with small solder pads.

  • Small electronic components, including wires, cannot dissipate heat as quickly as larger components. This makes them very susceptible to overheating. Make sure to heat the connection just long enough to melt the solder.

  • The leads were removed from the solder pads by heating the joint on the top side of the board, while pulling out the leads with a pair of tweezers.

次は、中難易度のはんだ付けの応用を説明します。この場合では、かなり細くて繊細なリードを、小さなはんだパッドを使用した回路基板にはんだ付けします。

ワイヤなどの小型の電子部品は、大型部品ほど熱を消散させることができません。そのため、オーバーヒーティングがかなり発生しやすくなります。必ずはんだがちょうど溶ける程度に接点を加熱してください。

ピンセットでリードを引っ張りながら、基板の上側にある接合部を加熱して、リードをはんだパッドから取り外しました。

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