Salta al contenuto principale

Avviso: Stai modificando una guida prerequisita. Tutte le modifiche avranno effetto sulla guida che include questo passo.

Inglese
Francese

Traduzione in corso passo 7

Passo 7
Next we will cover a moderately difficult soldering application.  In our case, we will be soldering very thin and delicate leads to a circuit board with small solder pads.
Intermediate Guide
  • Next we will cover a moderately difficult soldering application. In our case, we will be soldering very thin and delicate leads to a circuit board with small solder pads.

  • Small electronic components, including wires, cannot dissipate heat as quickly as larger components. This makes them very susceptible to overheating. Make sure to heat the connection just long enough to melt the solder.

  • The leads were removed from the solder pads by heating the joint on the top side of the board, while pulling out the leads with a pair of tweezers.

Ensuite, nous allons passer à une soudure moyennement difficile. Dans notre cas, nous souderons des fils très fins et fragiles à un circuit imprimé avec de petites pastilles de soudure.

Les petits composants électroniques, y compris les fils, ne peuvent pas évacuer la chaleur aussi rapidement que les composants plus gros. Cela les rend très sensibles à la surchauffe. Assurez-vous de chauffer la connexion juste assez longtemps pour faire fondre la soudure.

Les fils ont été retirés des pastilles de soudure en chauffant la pastille de soudure sur la face supérieure de la carte, tout en tirant les fils à l'aide d'une pincette.

I tuoi contributi sono usati su licenza in base alla licenza open source Creative Commons.