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Passo 6
Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile. Here are the front-side chips:
  • Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile.

  • Here are the front-side chips:

  • HiSilicon Kirin 955 (likely a HiSilicon Hi3650) octa-core processor layered underneath 3 GB of SK Hynix H9CKNNNDATMUQRN-UH LPDDR3 RAM

  • Samsung KLMBG2JENB-B041 32 GB eMMC NAND flash memory

  • Texas Instruments BQ25892 fast charging IC

  • HiSilicon Hi6402 audio codec

  • Maxim Integrated MAX98925 audio amplifier

  • Altek AL6610-72M1 AI camera processor (likely)

谁把嚼过的口香糖忘在这了?取下主板后,可以看到机身上的导热硅脂比常见的手机多不少。

这是主板正面的芯片:

海力士 H9CKNNNDATMU 24Gb(3GB)LPDDR3 内存

三星 KLMBG2JENB 32GB eMMC 闪存(存储)

德州仪器 BQ25892 快充电源管理

海思(华为自有) Hi6402 音频编码解码芯片

[* black] Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile.
[* black] Here are the front-side chips:
- [* red] SKhynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMU|new_window=true] 24 Gb (3 GB) LPDDR3 RAM
- [* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/emmc/KLMBG2JENB-B041?ia=2324|KLMBG2JENB|new_window=true] 32 GB eMMC flash memory
+ [* red] HiSilicon Kirin 955 (likely a HiSilicon Hi3650) octa-core processor layered underneath 3 GB of SK Hynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMUQRN-UH|new_window=true] LPDDR3 RAM
+ [* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/emmc/KLMBG2JENB-B041?ia=2324|KLMBG2JENB-B041|new_window=true] 32 GB eMMC NAND flash memory
[* yellow] Texas Instruments [http://www.ti.com/product/BQ25892|BQ25892|new_window=true] fast charging IC
[* green] HiSilicon Hi6402 audio codec
+ [* light_blue] Maxim Integrated MAX98925 audio amplifier
+ [* blue] Altek AL6610-72M1 AI camera processor (likely)

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