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Passo 6
Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile. Here are the front-side chips:
  • Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile.

  • Here are the front-side chips:

  • SKhynix H9CKNNNDATMU 24 Gb (3 GB) LPDDR3 RAM

  • Samsung KLMBG2JENB 32 GB eMMC flash memory

  • Texas Instruments BQ25892 fast charging IC

  • HiSilicon Hi6402 audio codec

Wer hat seinen Kaugummi hier drin versteckt? Beim Lösen des Motherboards kam mehr Thermalpaste zum Vorschein als wir jemals zuvor in einem Smartphone gesehen haben.

Hier die eingebauten Chips der Vorderseite:

SKhynix H9CKNNNDATMU 24 Gb (3 GB) LPDDR3 RAM

Samsung KLMBG2JENB 32 GB eMMC Flash Speicher

Texas Instruments BQ25892 Schnelllade- IC

HiSilicon Hi6402 Audio Codec

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