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Smontaggio Galaxy S7 Edge

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Traduzione in corso passo 9

Passo 9
Samsung Galaxy S7 Edge Teardown: passo 0, immagine 1 di 2 Samsung Galaxy S7 Edge Teardown: passo 0, immagine 2 di 2
  • IC identification, pt. 2:

  • DSP Group DBMD4 audio/voice processor

  • Zinitix ZF115N haptic driver

  • Maxim Integrated MAX77838EWO power management

  • ETEK Microelectronics ET9529 over-voltage protection switch and an ON Semiconductor FPF2495B over-voltage/current protection load switch

  • Diodes Incorporated AP7346D-3318FS6-7 and AP7340D-18FS4-7 LDO regulators

  • Knowles MEMS microphone

  • NXP Semiconductor NCX2200 comparator and a Toshiba TC7SBD385FU bus switch

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+[* black] IC identification, pt. 2:
+ [* red] DSP Group [http://www.dspg.com/wp-content/uploads/DBMD4-Part-Number-D4A1A-Data-Brief-.pdf|DBMD4|new_window=true] audio/voice processor
+ [* orange] Zinitix ZF115N haptic driver
+ [* yellow] Maxim Integrated MAX77838EWO power management
+ [* green] ETEK Microelectronics ET9529 over-voltage protection switch and an ON Semiconductor [link|https://www.onsemi.com/products/power-management/protected-power-switches/fpf2495b|FPF2495B] over-voltage/current protection load switch
+ [* light_blue] Diodes Incorporated [link|https://www.diodes.com/part/view/AP7346|AP7346D-3318FS6-7] and [link|https://www.diodes.com/part/view/AP7340|AP7340D-18FS4-7] LDO regulators
+ [* blue] Knowles MEMS microphone
+ [* violet] NXP Semiconductor [link|https://www.nxp.com/part/NCX2200GW#/|NCX2200] comparator and a Toshiba TC7SBD385FU bus switch

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