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Traduzione in corso passo 11

Passo 11
The headphone jack, earpiece speaker, and proximity/ambient light sensors reside on one cable. Seems oddly familiar...
  • The headphone jack, earpiece speaker, and proximity/ambient light sensors reside on one cable.

  • Seems oddly familiar...

  • We applaud the efforts of smartphone manufacturers to move commonly-broken components (such as the headphone jack) to cables/boards separate from the motherboard. But attaching several components on the same cable also increases the overall cost of the cable, thereby increasing the repair cost of just one component.

La prise jack, le haut-parleur interne et les capteurs de proximité et de luminosité ambiante se trouvent sur une seule nappe.

Ça me semble étrangement familier...

Nous saluons les efforts des fabricants de smartphones pour déplacer des composants tombant facilement en panne (comme la prise jack) vers des nappes/cartes séparées de la carte mère. Mais fixer plusieurs composants sur la même nappe augmente le coût global de la nappe, et donc le coût de réparation de ce seul composant.

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