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Traduzione in corso passo 11

Passo 11
As ChipWorks noted in their recent Galaxy S6 analysis, more and more of the chips in Samsung's flagship phones seem to be originating in-house. On the front side of the mobo, we find:
  • As ChipWorks noted in their recent Galaxy S6 analysis, more and more of the chips in Samsung's flagship phones seem to be originating in-house. On the front side of the mobo, we find:

  • Samsung Exynos 7420 Octa-core Processor - 64-bit, 2.1 GHz Quad + 1.5 GHz Quad, with Samsung K3RG3G30MM-DGCH 3 GB LPDDR4 RAM layered in

  • Samsung KLUBG4G1BD 32GB NAND Flash

  • Skyworks 78041 Hybrid Multimode Multiband (MMMB) Front-End Module (FEM)

  • Avago AFEM-9020 PAM

  • Wolfson Microelectronics WM1840 Audio Codec and Maxim MAX98505 Class DG Audio Amplifier

  • Samsung N5DDPS3 - Similar to the N5DDPS2 spotted in the Galaxy S6, likely NFC Controller

  • InvenSense MP65M 6-Axis Accel + Gyro, and Samsung C2N89U (likely image processor)

ChipWorks在他们的最近的盖乐世 S6 分析中指出,看起来在三星的旗舰手机中越来越多的芯片源于in-house模式。在主板的前侧,可以看到:

三星 Exynos 7420 Octa-core 处理器 - 64位, 2.1 GHz 四核 + 1.5 GHz 四核, 及三星 K3RG3G30MM-DGCH 3 GB LPDDR4 RAM

三星 KLUBG4G1BD 32GB NAND 闪存

思佳讯(Skyworks) 78041 混合多模多频 (MMMB) 前端模块 (FEM)

安华高(Avago) AFEM-9020 PAM

欧胜微电子(Wolfson Microelectronics )WM1840 音频解码及美信(Maxim) MAX98505 DG级音频放大器

三星 N5DDPS3 - 类似在盖乐世S6上发现的N5DDPS2 , 可能是NFC控制器

应美盛(InvenSense) MP65M 6轴加速 + 陀螺仪,及三星 C2N89U (可能是图形处理器)

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