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Traduzione in corso passo 5

Passo 5
When reassembling your device, attach the gasket to the heat sink as shown. The tail of the gasket should fit into the notch in the heat sink, it should not end up underneath the heat sink tab that will rest on the logic board.
  • When reassembling your device, attach the gasket to the heat sink as shown.

  • The tail of the gasket should fit into the notch in the heat sink, it should not end up underneath the heat sink tab that will rest on the logic board.

  • Be sure the small post molded into the rubber gasket mates with the hole cut into the upper right corner of the logic board.

Lors du remontage de votre appareil, fixez le joint au dissipateur thermique comme indiqué.

Le bout du joint devrait rentrer dans l'encoche dans le dissipateur thermique, il ne devrait pas aller sous l'onglet du dissipateur thermique qui repose sur la carte mère.

Assurez-vous que le petit embout moulé dans le joint en caoutchouc rentre dans le trou taillé dans le coin supérieur droit de la carte mère.

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