Traduzione in corso passo 5
Place the brand new 256GB NAND on the repair platform. Get the BGA Reballing Stencil in position. Smear medium-temp solder paste evenly on the stencil.
Heat with Hot Air Gun so that all solder balls can shape up completely. Once completed, wait for 1 minute.
Then separate the NAND flash chip from the stencil. Heat again to ensure the formation of solder balls.