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Giapponese

Traduzione in corso passo 5

Passo 5
Slide the opening pick from the bottom right corner along the side to the top. Apply more heat if the adhesive becomes hard to cut. During the removal process, the back cover is under tension all the time and is likely to break if the adhesive isn't softened enough. Slide the opening pick around the corner and cut the remaining adhesive at the top of the phone.
  • Slide the opening pick from the bottom right corner along the side to the top.

  • Apply more heat if the adhesive becomes hard to cut. During the removal process, the back cover is under tension all the time and is likely to break if the adhesive isn't softened enough.

  • Slide the opening pick around the corner and cut the remaining adhesive at the top of the phone.

  • Don't open the phone all the way yet. The fragile fingerprint sensor cable still connects the back cover to the motherboard.

下部右側コーナーから開口ピックをデバイス上部に向けてスライドします。

接着剤が硬くなってカットできない場合は、さらに接着剤を温めて柔らかくします。この作業では、常にバックカバーにストレスが加えられており、接着剤が十分に柔らかくなっていなければ、バックカバーにダメージを与えてしまいます。

開口ピックをコーナー周辺でスライドし、デバイス上部に残っている接着剤をカットしてください。

まだデバイスを完全に開かないでください。壊れやすい指紋認証センサのケーブルがマザーボードとバックカバーを繋いでいます。

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