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Introduzione

When dealing with iPhone XS motherboard issues, the double layered motherboard needs to be desoldered&resoldered. The phone might get stuck in won’t turn on issue due to pseudo soldering caused by improper layer alignment or uneven heating during the process. Well, our repair guide today shall enlighten you. iPhone XS won’t turn on repair with the help of an easy operated heating platform that can heat the board safely and evenly. Also, for repair technicians, it’s important for you to understand how iPhone boot circuit works before starting your repair work.

Panoramica Video

  1. Hold the power button to turn on the phone. There is no response from the phone.
    • Hold the power button to turn on the phone. There is no response from the phone.

    • Take apart the phone and take out the motherboard.

    • Measure the boot current first. The current pointer moves from 0 to 100mA, then 0, back and forth.

    • Judging by this, the upper layer or the third space PCB has malfunctioned.

  2. Place the motherboard on the specialized Heating Platform. With temperature of the platform reaching 140℃, insert the prying knife between the upper layer and the third space PCB.
    • Place the motherboard on the specialized Heating Platform. With temperature of the platform reaching 140℃, insert the prying knife between the upper layer and the third space PCB.

    • With the whole upper layer being loose, pick up the upper layer with tweezers. Continue to take the lower layer off the platform.

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  4. Connect the upper layer with the Power Supplier.
    • Connect the upper layer with the Power Supplier.

    • Judging by the reading on the ammeter, the upper layer can be powered up normally. So the fault might be related to the third space PCB.

  5. We need to re-solder the upper layer with the third space PCB.
    • We need to re-solder the upper layer with the third space PCB.

    • Attach the upper layer and the lower layer to the Holder. Clean the third space PCB with Soldering Iron. Clean with PCB Cleaner afterwards.

  6. First, we need to reball the lower layer.
    • First, we need to reball the lower layer.

    • Then, attach the reball finished lower layer to the heating platform and get the upper layer in position.

    • Once the two layers have been soldered together, wait for the double-stacked motherboard to cool for 10 minutes.

  7. Now we can assemble the phone and test. Hold the power button to turn on the phone. The phone turns on normally.
    • Now we can assemble the phone and test. Hold the power button to turn on the phone. The phone turns on normally.

Phryne

Membro da: 17/11/2019

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