Storia Motorola Droid RAZR Teardown Passo n. 19

Modifiche al passo #19

Modifica di Bees — 23 nov 2011

	[* black] So many chips…where's the dip?:
	[* red] [http://www.skyworksinc.com/Product.aspx?ProductID=451\|Skyworks 77449] Power Amplifier Module for LTE/EUTRAN Bands XIII/XIV
	[* orange] [http://www2.electronicproducts.com/Motorola_Xoom_MZ600-whatsinside_text-111.aspx\|Toshiba Y9A0A111308LA] Memory Stack
	[* yellow] ST Ericsson CPCAP 6556002
	[* green] Hynix H90H1GH51JMP (similar to [guide\|7099\|other devices\|stepid=30262] we've seen, this POP chip sits on top of the TI OMAP 4430 processor)
	[* blue] Infineon 5726 SLU A1 H1118 3A126586
	[* violet] Bosch 2133 C3H L1ABG accelerometer
-	[* black] And the back of the board? Nothing of ~~interest, which makes sense given how tightly packed the motherboard is to the display~~.
+	[* black] And the back of the board? Even the PCB is stepped with a cavity to recess the flex wrap from back to front. Nothing spared in the pursuit of ultimate thinness. Lovely.