Modifiche al passo #7
Righe Passo
| [* black] Detto ciò, è ora di analizzare digitalmente gli ID di alcuni chip. Sulla parte frontale della scheda madre, notiamo: | |
| - | [* red] 4 GB di SDRAM LPDDR4 SK Hynix [https://www.skhynix.com/static/filedata/fileDownload.do?seq=280|H9KNNNCTUMU-BRNMH] disposti sopra il processore Qualcomm [https://www.qualcomm.com/products/snapdragon/processors/820|MSM8996] Snapdragon 820 |
| - | [* orange] 32 GB di memoria MLC Universal Flash Storage 2.0 Samsung [http://www.samsung.com/semiconductor/products/flash-storage/ufs/KLUBG4G1CE-B0B1?ia=2413|KLUBG4G1CE] |
| + | [* red] 4 GB di SDRAM LPDDR4 SK Hynix [https://www.skhynix.com/static/filedata/fileDownload.do?seq=280|H9KNNNCTUMU-BRNMH|new_window=true] disposti sopra il processore Qualcomm [https://www.qualcomm.com/products/snapdragon/processors/820|MSM8996|new_window=true] Snapdragon 820 |
| + | [* orange] 32 GB di memoria MLC Universal Flash Storage 2.0 Samsung [http://www.samsung.com/semiconductor/products/flash-storage/ufs/KLUBG4G1CE-B0B1?ia=2413|KLUBG4G1CE|new_window=true] |
| [* yellow] Modulo Multiband Multimode Avago AFEM-9040 | |
| [* green] Modulo FrontEnd Murata FAJ15 | |
| - | [* light_blue] Modulo Fusion RF high band Qorvo [http://www.qorvo.com/news/2016/qorvo-recognized-with-prestigious-global-td-lte-initiative-award-for-rf-fusion|QM78064] e modulo ricezione diversity [http://www.qorvo.com/news/2016/qorvo-expands-support-of-highly-anticipated-marquee-smartphone-platform|QM63001A] |
| + | [* light_blue] Modulo Fusion RF high band Qorvo [http://www.qorvo.com/news/2016/qorvo-recognized-with-prestigious-global-td-lte-initiative-award-for-rf-fusion|QM78064|new_window=true] e modulo ricezione diversity [http://www.qorvo.com/news/2016/qorvo-expands-support-of-highly-anticipated-marquee-smartphone-platform|QM63001A|new_window=true] |
| [* blue] Codec Audio Qualcomm WCD9335 | |
| [* violet] PMIC (chip gestione alimentazione) Maxim MAX77854 e amplificatore audio MAX98506BEWV |