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Modifiche al passo #9

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[* black] Tutta questa colla ci ha stufato; ora sediamoci a guardare qualche chip:
[* red] 4 GB di DRAM LPDDR4X Micron 8JE77G9WGH stratificata sopra al processore Qualcomm Snapdragon 845
[* orange] 64 GB di memoria Universal flash storage Skhynix [https://www.skhynix.com/eng/product/nandUFS.jsp|H28S7Q302BMR|new_window=true]
[* yellow] Pixel Visual Core Google [https://blog.google/products/pixel/pixel-visual-core-image-processing-and-machine-learning-pixel-2/|SR3HX|new_window=true] (già visto nel [https://it.ifixit.com/Smontaggio/Google+Pixel+2+XL+Teardown/98093#s180076|Pixel 2 XL|new_window=true])
[* green] Ricetrasmettitore RF Qualcomm SDR845
[* light_blue] Qualcomm QPM2622 e QPM2642
[* blue] Envelope tracker 40 MHz Qualcomm [https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET410|new_window=truehttps://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET4100|new_window=true]
[* blue] Envelope tracker 40 MHz Qualcomm [https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET410|new_window=truehttps://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET4100|new_window=true]
[* violet] PMIC Qualcomm [http://www.eenewspower.com/news/adaptive-power-management-added-mobile-chipset|PMI8998|new_window=true]