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HTC myTouch 3G Motherboard Replacement

Scritto Da: Tony Tran (e 7 altri collaboratori)
  • Commenti: 0
  • Preferiti: 5
  • Completamenti: 2

Difficoltà

Moderato

Passi

8

Tempo Necessario

30 - 45 minuti

Sezioni

1

Contrassegni

4

Grammar Police

Vigilanza sulla Grammatica

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Confusing Text

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Slice and Dice

Fallo a Fettine

I passaggi in questa guida dovrebbero essere suddivisi e trasformati in una serie di guide prerequisite.

Introduzione

This guide describes the steps to separate the HTC myTouch motherboard from the glass screen for replacement or repair. This guide will require you to unscrew a T5 Torx screw with a VOID label. Unfastening this screw would void any warranty the phone may have.

  1. Press each thumb on both sides of the upper corners and apply pressure downwards. Then, while still applying pressure, slide the back cover down.

    • Press each thumb on both sides of the upper corners and apply pressure downwards.

    • Then, while still applying pressure, slide the back cover down.

    Traduci

  2. Remove the Battery. Remove the SIM card.

    • Remove the Battery.

    • Remove the SIM card.

    Traduci

  3. Push the SD card in and the SD card should pop loose.

    • Push the SD card in and the SD card should pop loose.

    • Pull the SD card out.

    Traduci

  5. Remove the four 6-mm T5 torx screws in the four corners. Remove the two 4-mm T5 torx screws in the middle.

    • Remove the four 6-mm T5 torx screws in the four corners.

    • Remove the two 4-mm T5 torx screws in the middle.

    Traduci

  6. Use the existing gap, to dislodge the antenna cover from the phone. Pull out the antenna cover to have access to the motherboard.

    • Use the existing gap, to dislodge the antenna cover from the phone.

    • Pull out the antenna cover to have access to the motherboard.

    Traduci

  7. Use a precision flathead screwdriver to dislodge the back plate from the phone by carefully inserting it into the slit between the frame and cover and pushing downward. Go around the edges of the phone, and continue to dislodge the back plate from the front part of the phone.

    • Use a precision flathead screwdriver to dislodge the back plate from the phone by carefully inserting it into the slit between the frame and cover and pushing downward.

    • Go around the edges of the phone, and continue to dislodge the back plate from the front part of the phone.

    Traduci

  8. Remove the 3-mm Phillips head screw located on the side of the bottom left-hand corner of the phone. Remove the 3-mm Phillips head screw located on the top right-hand corner of the phone.

    • Remove the 3-mm Phillips head screw located on the side of the bottom left-hand corner of the phone.

    • Remove the 3-mm Phillips head screw located on the top right-hand corner of the phone.

    • Do not remove any of the screws located on the actual circuit boards.

    Traduci

  9. Place a finger between the circuit board and the front cover, and lift up gently. Continue separating the circuit board from the front cover and screen and watch for a ribbon cable to detach. Finish separating the circuit board from the front panel.

    • Place a finger between the circuit board and the front cover, and lift up gently.

    • Continue separating the circuit board from the front cover and screen and watch for a ribbon cable to detach.

    • Finish separating the circuit board from the front panel.

    Traduci
Conclusione

To reassemble your device, follow these instructions in reverse order.

Altre 2 persone hanno completato questa guida.

Autore

con 7 altri collaboratori

Tony Tran

Membro da: 25/09/2012

381 Reputazione

3 Guide realizzate

Distintivi: 9

+6 altri distintivi

Team

Cal Poly, Team 2-9, Propen Fall 2012 Membro di Cal Poly, Team 2-9, Propen Fall 2012

CPSU-PROPEN-F12S2G9

3 Membri

5 Guide realizzate

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